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Solder(1714)
| Image | Product Number | Pricing(USD) | Quantity | ECAD | Quantity Available | Weight(Kg) | Mfr | Series | Package | Product Status | Type | Base Product Number | Weight | Shelf Life | Shelf Life Start | Storage/Refrigeration Temperature | Shipping Info | DataSheet | RoHS Status | Moisture Sensitivity Level (MSL) | REACH Status | Other Names | ECCN | HTSUS | Standard Package | Composition | Form | Diameter | Melting Point | Flux Type | Wire Gauge | Process | SIC Storage | Mesh Type |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 |
NC2SWLF.015 1OZ | 12.4100 |  |
24 | 0.00000000 | Chip Quik Inc. | CHIPQUIK® | Bulk | Active | Wire Solder | NC2SW | - | - | - | - | - | download | ROHS3 Compliant | Not Applicable | REACH Unaffected | 315-NC2SWLF.0151OZ | EAR99 | 8311.30.6000 | 1 | Sn99.3Cu0.7 (99.3/0.7) | Spool, 1 oz (28.35g) | 0.015" (0.38mm) | 441°F (227°C) | No-Clean | - | - | |||
|
24-6337-7612 | - | |
8976 | 0.00000000 | Kester Solder | 275 | Spool | Obsolete | Wire Solder | - | - | 50°F ~ 104°F (10°C ~ 40°C) | download | RoHS non-compliant | Not Applicable | REACH Unaffected | EAR99 | 8311.30.3000 | 25 | Sn63Pb37 (63/37) | Spool, 1 lb (454 g) | 0.050" (1.27mm) | 361°F (183°C) | No-Clean | 16 AWG, 18 SWG | Leaded | |||||||
 |
TS391SNL50 | 17.9500 | |
8 | 0.00000000 | Chip Quik Inc. | - | Bulk | Active | Solder Paste | TS391S | 12 Months | Date of Manufacture | 68°F ~ 77°F (20°C ~ 25°C) | - | download | ROHS3 Compliant | Not Applicable | REACH Unaffected | EAR99 | 3810.10.0000 | 1 | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | Jar, 1.76 oz (50g) | - | 423 ~ 428°F (217 ~ 220°C) | No-Clean | - | Lead Free | 4 | ||||
|
24-7050-8813 | - | |
5540 | 0.00000000 | Kester Solder | 44 | Bulk | Obsolete | Wire Solder | - | - | 50°F ~ 104°F (10°C ~ 40°C) | - | download | RoHS Compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8311.30.6000 | 25 | Sn96.3Ag3.7 (96.3/3.7) | Spool, 1 lb (454 g) | 0.040" (1.02mm) | 430 ~ 444°F (221 ~ 223°C) | Rosin Activated (RA) | 18 AWG, 19 SWG | Lead Free | ||||||
|
14-5050-0062 | - | |
2763 | 0.00000000 | Kester Solder | - | Bulk | Active | Wire Solder | 14-5050 | - | - | 50°F ~ 104°F (10°C ~ 40°C) | - | download | RoHS non-compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8311.30.3000 | 25 | Sn50Pb50 (50/50) | Spool, 1 lb (454 g) | 0.062" (1.57mm) | 361 ~ 420°F (183 ~ 216°C) | - | 14 AWG, 16 SWG | Leaded | |||||
 |
RCBLF22701020P | 68.3800 | |
50 | 0.00000000 | Canfield Technologies | - | Spool | Active | Wire Solder | 24 Months | Date of Manufacture | 50°F ~ 104°F (10°C ~ 40°C) | - | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | 3844-RCBLF22701020P | 1 | BLF 227 (99.17Sn/.8Cu/.03Ni) | Spool, 1 lb (453.59g) | 0.020" (0.51mm) | 440°F (227°C) | Rosin Activated (RA) | 24 AWG, 25 SWG | Lead Free | ||||||||
 |
24-7068-6422 | 139.3100 | |
79 | 0.00000000 | Kester Solder | 331 | Spool | Active | Wire Solder | 24-7068 | 36 Months | Date of Manufacture | 50°F ~ 104°F (10°C ~ 40°C) | download | ROHS3 Compliant | Not Applicable | REACH Unaffected | EAR99 | 8311.30.6000 | 25 | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | Spool, 1 lb (454 g) | 0.015" (0.38mm) | 423 ~ 424°F (217 ~ 218°C) | Water Soluble | 27 AWG, 28 SWG | Lead Free | ||||||
 |
70-4105-0810 | 142.5310 | |
7634 | 0.00000000 | Kester Solder | NP545 | Bulk | Active | Solder Paste | 70-4105 | 12 Months | Date of Manufacture | 32°F ~ 50°F (0°C ~ 10°C) | - | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8311.90.0000 | 10 | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | Jar, 17.64 oz (500g) | - | 423 ~ 424°F (217 ~ 218°C) | No-Clean | - | Lead Free | 3 | ||||
 |
TS391LT250 | 84.9500 | |
1121 | 0.00000000 | Chip Quik Inc. | - | Bulk | Active | Solder Paste | TS391L | 12 Months | Date of Manufacture | 68°F ~ 77°F (20°C ~ 25°C) | - | download | ROHS3 Compliant | Not Applicable | REACH Unaffected | EAR99 | 3810.10.0000 | 1 | Bi57.6Sn42Ag0.4 (57.6/42/0.4) | Jar, 8.8 oz (250g) | - | 281°F (138°C) | No-Clean | - | Lead Free | 4 | ||||
 |
T0051386799 | 118.0000 | |
3 | 0.00000000 | Apex Tool Group | Weller® | Spool | Active | Wire Solder | - | - | - | - | - | download | 1 (Unlimited) | REACH Unaffected | 72-T0051386799 | EAR99 | 8311.30.6000 | 1 | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | Spool, 17.64 oz (500g) | 0.047" (1.19mm) | - | No-Clean | - | Lead Free | |||||
 |
NC191LTA50T5 | 27.9500 | |
1338 | 0.00000000 | Chip Quik Inc. | Smooth Flow™ | Bulk | Active | Solder Paste | NC191 | 12 Months | Date of Manufacture | 37°F ~ 46°F (3°C ~ 8°C) | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | 315-NC191LTA50T5 | EAR99 | 3810.10.0000 | 1 | Bi57Sn42Ag1 (57/42/1) | Jar, 1.76 oz (50g) | - | 279°F (137°C) | No-Clean | - | - | 5 | ||||
 |
NC191LT50 | 18.9500 | |
7437 | 0.00000000 | Chip Quik Inc. | Smooth Flow™ | Bulk | Active | Solder Paste | NC191 | 6 Months | Date of Manufacture | 37°F ~ 46°F (3°C ~ 8°C) | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | 315-NC191LT50 | EAR99 | 3810.10.0000 | 1 | Bi57.6Sn42Ag0.4 (57.6/42/0.4) | Jar, 1.76 oz (50g) | - | 280°F (138°C) | No-Clean | - | Lead Free | 4 | ||||
 |
SMD3SW.031 1OZ | 14.3500 | |
2 | 0.00000000 | Chip Quik Inc. | SMD3 | Bulk | Active | Wire Solder | SMD3S | - | - | - | - | - | download | ROHS3 Compliant | Not Applicable | REACH Affected | EAR99 | 8311.90.0000 | 1 | Sn62Pb36Ag2 (62/36/2) | Spool, 1 oz (28.35g) | 0.031" (0.79mm) | 354°F (179°C) | No-Clean, Water Soluble | - | Leaded | ||||
 |
CWSN60 NCCW2.2 .015 | 56.1500 | |
100 | 0.00000000 | Amerway Inc | - | Box | Active | Wire Solder | CWSN60 | - | - | - | - | RoHS non-compliant | 2757-CWSN60NCCW2.2.015 | 1 | Sn60Pb40 (60/40) | Spool, 1 lb (453.59g) | 0.015" (0.38mm) | - | - | - | - | |||||||||
 |
77-6337-0050 | - | |
3127 | 0.00000000 | Kester Solder | ULTRAPURE® | Bulk | Active | Bar Solder | 77-6337 | - | - | - | - | download | RoHS non-compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8311.30.3000 | 25 | Sn63Pb37 (63/37) | Bar, 10 lbs (4.54kg) | - | 361°F (183°C) | - | - | Leaded | - | ||||
 |
4895-454G | 65.0800 | |
3 | 0.00000000 | MG Chemicals | 4890 | Spool | Active | Wire Solder | 4895 | 1 lb (453.59 g) | 60 Months | - | - | - | download | RoHS non-compliant | Not Applicable | REACH Affected | EAR99 | 8311.30.3000 | 3 | Sn60Pb40 (60/40) | Spool, 1 lb (454 g) | 0.032" (0.81mm) | 361 ~ 376°F (183 ~ 191°C) | Rosin Activated (RA) | 20 AWG, 21 SWG | Leaded | - | |||
 |
70-4006-2010 | 170.5990 | |
9921 | 0.00000000 | Kester Solder | NP505-HR | Bulk | Active | Solder Paste | 70-4006 | 6 Months | Date of Manufacture | 32°F ~ 50°F (0°C ~ 10°C) | Ships with Cold Pack. To ensure customer satisfaction and product integrity, air shipment is recommended. | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8311.90.0000 | 10 | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | Jar, 17.64 oz (500g) | - | 423 ~ 424°F (217 ~ 218°C) | No-Clean | - | Lead Free | 5 | ||||
 |
2023641 | 162.7800 | |
7607 | 0.00000000 | Harimatec Inc. | LOCTITE® GC 10 | Bulk | Active | Solder Paste | - | 12 Months | Date of Manufacture | 41°F ~ 77°F (5°C ~ 25°C) | - | download | ROHS3 Compliant | Not Applicable | EAR99 | 3810.10.0000 | 1 | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | Cartridge, 21.16 oz (600g) | - | 423°F (217°C) | No-Clean | - | Lead Free | - | |||||
 |
CWSnCu0.7Ni RMA3% .032 1# | 91.3000 | |
100 | 0.00000000 | Amerway Inc | - | Tape & Box (TB) | Active | - | ROHS3 Compliant | REACH Affected | 2757-CWSnCu0.7NiRMA3%.0321#TB | 1 | ||||||||||||||||||||
|
TOL-10243 | 27.5000 | |
6375 | 0.00000000 | SparkFun Electronics | - | Bulk | Active | Wire Solder | - | - | - | - | - | - | ROHS3 Compliant | 1 (Unlimited) | 1568-TOL-10243 | 1 | Sn96.35Cu0.5Sb0.15Ag3 (96.35/0.5/0.15/3) | Spool, 4 oz (113.40g) | 0.031" (0.79mm) | - | Water Soluble | - | Lead Free | |||||||
|
147226 | - | |
9987 | 0.00000000 | Kester Solder | * | Cut Tape (CT) | Active | - | - | - | - | RoHS Compliant | Vendor Undefined | REACH Unaffected | EAR99 | 8311.90.0000 | 4,000 | |||||||||||||||
 |
SMD291SNL500T5 | 198.9500 | |
8103 | 0.00000000 | Chip Quik Inc. | - | Jar | Active | Solder Paste | SMD291 | 6 Months | Date of Manufacture | 37°F ~ 46°F (3°C ~ 8°C) | Ships with Cold Pack. To ensure customer satisfaction and product integrity, air shipment is recommended. | download | ROHS3 Compliant | Not Applicable | REACH Unaffected | EAR99 | 3810.10.0000 | 1 | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | Jar, 17.64 oz (500g) | - | 423 ~ 428°F (217 ~ 220°C) | No-Clean | - | Lead Free | 5 | ||||
|
2164169 | - | |
2720 | 0.00000000 | LOCTITE | LM100 | Bulk | Active | Solder Paste | 6 Months | Date of Manufacture | - | - | - | RoHS non-compliant | Not Applicable | EAR99 | 8311.90.0000 | 10 | Bi58Sn42 (58/42) | Jar | - | 281°F (138°C) | No-Clean | - | Lead Free | - | - | |||||
 |
SMDLTLFP60T4 | 40.9500 | |
8221 | 0.00000000 | Chip Quik Inc. | - | Bulk | Active | Solder Paste, Two Part Mix | SMDLTL | 24 Months | Date of Manufacture | 37°F ~ 77°F (3°C ~ 25°C) | download | ROHS3 Compliant | Not Applicable | REACH Unaffected | EAR99 | 8311.30.6000 | 1 | Bi57.6Sn42Ag0.4 (57.6/42/0.4) | Jar, 2.12 oz (60g) | - | 281°F (138°C) | No-Clean | - | Lead Free | 4 | |||||
 |
24-6337-8846 | 41.6564 | |
6582 | 0.00000000 | Kester Solder | 245 | Bulk | Active | Wire Solder | 24-6337 | - | - | 50°F ~ 104°F (10°C ~ 40°C) | - | download | 1 (Unlimited) | REACH Unaffected | EAR99 | 8311.30.3000 | 25 | Sn63Pb37 (63/37) | Spool, 1 lb (454 g) | 0.040" (1.02mm) | 361°F (183°C) | No-Clean | 18 AWG, 19 SWG | Leaded | ||||||
 |
733002 | 100.1500 | |
8525 | 0.00000000 | Harimatec Inc. | C511™ | Bulk | Active | Wire Solder | 1 lb (453.59 g) | - | - | - | - | download | ROHS3 Compliant | Not Applicable | EAR99 | 8311.30.3000 | 1 | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | Spool, 1 lb (454 g) | 0.032" (0.81mm) | 423°F (217°C) | No-Clean | 20 AWG, 21 SWG | Lead Free | - | |||||
|
90-7068-9850 | - | |
2709 | 0.00000000 | Kester Solder | 296 | Bulk | Obsolete | Wire Solder | - | - | - | - | download | RoHS Compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8311.30.6000 | 1 | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | Spool, 3.53 oz (100g) | 0.010" (0.25mm) | 423 ~ 424°F (217 ~ 218°C) | No-Clean | 30 AWG, 33 SWG | Lead Free | - | |||||
 |
NC191AX250 | 44.9500 | |
1898 | 0.00000000 | Chip Quik Inc. | Smooth Flow™ | Bulk | Active | Solder Paste | NC191 | 12 Months | Date of Manufacture | 37°F ~ 46°F (3°C ~ 8°C) | download | RoHS non-compliant | 1 (Unlimited) | REACH Affected | 315-NC191AX250 | EAR99 | 3810.10.0000 | 1 | Sn63Pb37 (63/37) | Jar, 8.8 oz (250g) | - | 361°F (183°C) | No-Clean | - | Leaded | 4 | ||||
|
24-6040-8815 | - | |
7595 | 0.00000000 | Kester Solder | 245 | Bulk | Active | Wire Solder | 24-6040 | - | - | 50°F ~ 104°F (10°C ~ 40°C) | - | download | 1 (Unlimited) | REACH Unaffected | EAR99 | 8311.30.3000 | 25 | Sn60Pb40 (60/40) | Spool, 1 lb (454 g) | 0.050" (1.27mm) | 361 ~ 374°F (183 ~ 190°C) | No-Clean | 16 AWG, 18 SWG | Leaded | ||||||
 |
SMD291AX | 14.9900 | |
40 | 0.00000000 | Chip Quik Inc. | - | Syringe | Active | Solder Paste | SMD291 | 0.033 lb (14.97 g) | 12 Months | Date of Manufacture | 37°F ~ 46°F (3°C ~ 8°C) | Ships with Cold Pack. To ensure customer satisfaction and product integrity, air shipment is recommended. | download | RoHS non-compliant | Not Applicable | REACH Affected | SMD 291AX | EAR99 | 3810.10.0000 | 1 | Sn63Pb37 (63/37) | Syringe, 0.53 oz (15g), 5cc | - | 361°F (183°C) | No-Clean | - | Leaded | Refrigerated | 3 |
2000+
Daily average RFQ Volume
30,000,000
Standard Product Unit
2800+
Worldwide Manufacturers
15,000 m2
In-stock Warehouse
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