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Solder(1714)
| Image | Product Number | Pricing(USD) | Quantity | ECAD | Quantity Available | Weight(Kg) | Mfr | Series | Package | Product Status | Type | Base Product Number | Weight | Shelf Life | Shelf Life Start | Storage/Refrigeration Temperature | Shipping Info | DataSheet | RoHS Status | Moisture Sensitivity Level (MSL) | REACH Status | Other Names | ECCN | HTSUS | Standard Package | Composition | Form | Diameter | Melting Point | Flux Type | Wire Gauge | Process | SIC Storage | Mesh Type |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 |
70-5023-2210 | 0.5900 |  |
7763 | 0.00000000 | Kester Solder | - | Bulk | Active | Solder Paste | - | 6 Months | Date of Manufacture | 32°F ~ 50°F (0°C ~ 10°C) | - | download | 117-70-5023-2210 | 1 | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | Jar, 17.64 oz (500g) | - | - | Water Soluble | - | Lead Free | |||||||||
 |
JPAGSC1501P | 162.8000 | |
50 | 0.00000000 | Canfield Technologies | - | Tube | Active | Brazing Rod | - | - | 50°F ~ 104°F (10°C ~ 40°C) | - | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | 3844-JPAGSC1501P | 1 | 15% Ag, 80% Cu, 5% Phos | Tube, 1 lb (454g) | - | 1190/1475°F (643/802°C) | - | - | Lead Free | ||||||||
 |
SMD3SWLT.047 2OZ | 24.6200 | |
11 | 0.00000000 | Chip Quik Inc. | SMD3 | Bulk | Active | Wire Solder | SMD3S | - | - | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | 315-SMD3SWLT.0472OZ | EAR99 | 8311.30.6000 | 1 | Bi58Sn42 (58/42) | Spool, 2 oz (56.70g) | 0.047" (1.19mm) | 280°F (138°C) | - | - | Lead Free | ||||||
 |
RC9601031PSAC | 89.3900 | |
100 | 0.00000000 | Canfield Technologies | - | Spool | Active | Wire Solder | - | 24 Months | Date of Manufacture | 50°F ~ 104°F (10°C ~ 40°C) | - | download | ROHS3 Compliant | 6 (Time on Label) | REACH Unaffected | 3844-RC9601031PSAC | 1 | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | Spool, 1 lb (454 g) | 0.031" (0.79mm) | 423 ~ 424°F (217 ~ 218°C) | Rosin Activated (RA) | 20 AWG, 22 SWG | Lead Free | ||||||
 |
NC2SWLF.031 1LB | 55.7500 | |
6806 | 0.00000000 | Chip Quik Inc. | - | Bulk | Active | Wire Solder | NC2SW | - | - | - | download | ROHS3 Compliant | Not Applicable | REACH Unaffected | NC2SWLF.0311LB | EAR99 | 8311.30.6000 | 1 | Sn99.3Cu0.7 (99.3/0.7) | Spool, 1 lb (454 g) | 0.031" (0.79mm) | 441°F (227°C) | No-Clean | 20 AWG, 21 SWG | Lead Free | |||||
 |
24-6337-7420 | 110.3486 | |
1097 | 0.00000000 | Kester Solder | 282 | Bulk | Active | Wire Solder | 24-6337 | - | - | - | - | download | 1 (Unlimited) | REACH Unaffected | EAR99 | 8311.30.3000 | 25 | Sn63Pb37 (63/37) | Spool, 1 lb (454 g) | 0.025" (0.64mm) | 361°F (183°C) | Rosin Mildly Activated (RMA) | 22 AWG, 23 SWG | Leaded | - | |||||
 |
583489 | - | |
3301 | 0.00000000 | Multicore | MP200 | Cartridge | Obsolete | Solder Paste | 0.055 lb (24.95 g) | 6 Months | Date of Manufacture | Room Temperature | Ships with Cold Pack. To ensure customer satisfaction and product integrity, air shipment is recommended. | download | RoHS non-compliant | Not Applicable | EAR99 | 3810.10.0000 | 36 | Sn63Pb37 (63/37) | Cartridge, 0.88 oz (25g) | - | 361°F (183°C) | No-Clean | - | Leaded | - | |||||
 |
CWSN60NCCW2 .032 1# | 47.2100 | |
100 | 0.00000000 | Amerway Inc | - | Box | Active | Wire Solder | CWSN60 | - | - | - | - | RoHS non-compliant | 2757-CWSN60NCCW2.0321# | 25 | Sn60Pb40 (60/40) | Spool, 1 lb (453.59g) | 0.032" (0.81mm) | - | - | - | - | |||||||||
|
92-6337-9702 | - | |
5902 | 0.00000000 | Kester Solder | 285 | Bulk | Obsolete | Wire Solder | 92-6337 | - | - | 50°F ~ 104°F (10°C ~ 40°C) | - | download | RoHS non-compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8311.30.3000 | 1 | Sn63Pb37 (63/37) | Spool, 17.64 oz (500g) | 0.020" (0.51mm) | 361°F (183°C) | Rosin Mildly Activated (RMA) | 24 AWG, 25 SWG | Leaded | |||||
 |
70-0202-0610 | 142.4500 | |
2964 | 0.00000000 | Kester Solder | EP256HA | Bulk | Active | Solder Paste | 70-0202 | 6 Months | Date of Manufacture | 32°F ~ 50°F (0°C ~ 10°C) | Ships with Cold Pack. To ensure customer satisfaction and product integrity, air shipment is recommended. | download | RoHS non-compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8311.90.0000 | 1 | Sn63Pb37 (63/37) | Jar, 17.64 oz (500g) | - | 361°F (183°C) | No-Clean | - | Leaded | 3 | ||||
 |
RC96L2020CQPJ | 56.5500 | |
50 | 0.00000000 | Canfield Technologies | - | Spool | Active | Wire Solder | 24 Months | Date of Manufacture | 50°F ~ 104°F (10°C ~ 40°C) | - | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | 3844-RC96L2020CQPJ | 1 | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | Spool, 8 oz (227g), 1/2 lb | 0.020" (0.51mm) | 423 ~ 424°F (217 ~ 218°C) | Rosin Activated (RA) | 24 AWG, 25 SWG | Lead Free | ||||||||
 |
386827 | 55.9500 | |
19 | 0.00000000 | Harimatec Inc. | 370 | Bulk | Active | Wire Solder | 1.1 lbs (499 g) | - | - | - | - | download | RoHS non-compliant | Not Applicable | EAR99 | 8311.30.3000 | 1 | Sn60Pb40 (60/40) | Spool, 17.64 oz (500g) | 0.032" (0.81mm) | 361 ~ 374°F (183 ~ 190°C) | Rosin Activated (RA) | 20 AWG, 21 SWG | Leaded | - | |||||
 |
70-3205-1810 | - | |
5703 | 0.00000000 | Kester Solder | NXG1 | Bulk | Obsolete | Solder Paste | 70-3205 | 8 Months | Date of Manufacture | 32°F ~ 50°F (0°C ~ 10°C) | Ships with Cold Pack. To ensure customer satisfaction and product integrity, air shipment is recommended. | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8311.90.0000 | 1 | Sn99.3Cu0.7 (99.3/0.7) | Jar, 17.64 oz (500g) | - | 441°F (227°C) | No-Clean | - | Lead Free | - | ||||
 |
4935-454G | - | |
7188 | 0.00000000 | MG Chemicals | 4935 | Spool | Obsolete | Wire Solder | 60 Months | Date of Manufacture | 65°F ~ 80°F (18°C ~ 27°C) | download | ROHS3 Compliant | Not Applicable | REACH Unaffected | 473-1248 | EAR99 | 8311.30.6000 | 1 | Sn99.5Cu0.5 (99.5/0.5) | Spool, 1 lb (454 g) | 0.032" (0.81mm) | 442°F (228°C) | No-Clean | 20 AWG, 21 SWG | Lead Free | ||||||
 |
SR37-LFM48S-3.5-0.5MM | 49.5500 | |
5 | 0.00000000 | Almit | - | Spool | Active | Wire Solder | 24 Months | Date of Manufacture | - | - | ROHS3 Compliant | 1 (Unlimited) | 2345-SR37-LFM48S-3.5-0.5MM | EAR99 | 8311.30.6000 | 1 | - | Spool, 3.53 oz (100g) | 0.020" (0.51mm) | - | - | - | Lead Free | |||||||
 |
SMD2150-25000 | 20.9900 | |
4 | 0.00000000 | Chip Quik Inc. | SMD2 | Bulk | Active | Solder Sphere | - | 24 Months | Date of Manufacture | - | - | download | RoHS non-compliant | Not Applicable | REACH Affected | EAR99 | 8311.90.0000 | 1 | Sn63Pb37 (63/37) | Jar | 0.010" (0.25mm) | 361°F (183°C) | - | - | Leaded | |||||
 |
4901-112G | 34.5400 | |
56 | 0.00000000 | MG Chemicals | 4901 | Spool | Active | Wire Solder | 4901 | 0.25 lb (113.4 g) | 60 Months | - | 65°F ~ 80°F (18°C ~ 27°C) | - | download | ROHS3 Compliant | Not Applicable | REACH Unaffected | EAR99 | 8311.30.6000 | 3 | Sn99.3Cu0.7 (99.3/0.7) | Spool, 4 oz (113.40g) | 0.032" (0.81mm) | 442°F (227°C) | No-Clean | 20 AWG, 21 SWG | Lead Free | ||||
 |
14-7068-0062 | 90.5950 | |
1826 | 0.00000000 | Kester Solder | Solid Core Wire | Bulk | Active | Wire Solder | 14-7068 | - | - | 50°F ~ 104°F (10°C ~ 40°C) | - | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8311.30.6000 | 25 | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | Spool, 1 lb (454 g) | 0.062" (1.57mm) | 423 ~ 424°F (217 ~ 218°C) | - | 14 AWG, 16 SWG | Lead Free | |||||
 |
24-4060-2437 | 49.0456 | |
5198 | 0.00000000 | Kester Solder | Acid Cored Wire | Bulk | Active | Wire Solder | 24-4060 | - | - | 50°F ~ 104°F (10°C ~ 40°C) | - | download | 1 (Unlimited) | REACH Unaffected | EAR99 | 8311.30.3000 | 25 | Pb60Sn40 (60/40) | Spool, 1 lb (454 g) | 0.125" (3.18mm) | 361 ~ 460°F (183 ~ 238°C) | Acid Cored | 8 AWG, 10 SWG | Leaded | ||||||
 |
SMD4300AX500T4C | 97.5000 | |
8673 | 0.00000000 | Chip Quik Inc. | CHIPQUIK® SMD4300 | Cartridge | Active | Solder Paste | SMD4300 | 12 Months | Date of Manufacture | 37°F ~ 46°F (3°C ~ 8°C) | Ships with Cold Pack. To ensure customer satisfaction and product integrity, air shipment is recommended. | download | ROHS3 Compliant | Not Applicable | REACH Unaffected | EAR99 | 8311.30.6000 | 1 | Sn63Pb37 (63/37) | Cartridge, 17.64 oz (500g) | - | 361°F (183°C) | No-Clean, Water Soluble | - | Leaded | 4 | ||||
 |
24-5050-0068 | - | |
1566 | 0.00000000 | Kester Solder | 44 | Bulk | Active | Wire Solder | 24-5050 | - | - | 50°F ~ 104°F (10°C ~ 40°C) | - | download | RoHS non-compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8311.30.3000 | 25 | Sn50Pb50 (50/50) | Spool, 1 lb (454 g) | 0.125" (3.18mm) | 361 ~ 420°F (183 ~ 216°C) | Rosin Activated (RA) | 8 AWG, 10 SWG | Leaded | |||||
 |
22-7150-8802 | 149.4598 | |
5412 | 0.00000000 | Kester Solder | 245 | Bulk | Active | Wire Solder | 22-7150 | - | - | 50°F ~ 104°F (10°C ~ 40°C) | - | download | 1 (Unlimited) | REACH Unaffected | EAR99 | 8311.30.6000 | 25 | Sn62Pb36Ag2 (62/36/2) | Spool, 2 lbs (907.19g) | 0.031" (0.79mm) | 354°F (179°C) | No-Clean | 20 AWG, 22 SWG | Leaded | ||||||
 |
TS391SNL250 | 69.9500 | |
8241 | 0.00000000 | Chip Quik Inc. | - | Bulk | Active | Solder Paste | TS391S | 12 Months | Date of Manufacture | 68°F ~ 77°F (20°C ~ 25°C) | - | download | ROHS3 Compliant | Not Applicable | REACH Unaffected | EAR99 | 3810.10.0000 | 1 | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | Jar, 8.8 oz (250g) | - | 423 ~ 428°F (217 ~ 220°C) | No-Clean | - | Lead Free | 4 | ||||
|
403674 | - | |
4386 | 0.00000000 | Harimatec Inc. | 381™ | Bulk | Obsolete | Wire Solder | - | - | - | - | download | RoHS non-compliant | Not Applicable | EAR99 | 8311.30.3000 | 40 | Sn63Pb37 (63/37) | Spool, 8.8 oz (250g) | 0.015" (0.38mm) | 361°F (183°C) | Rosin Mildly Activated (RMA) | 27 AWG, 28 SWG | Leaded | - | ||||||
 |
24-7040-8834 | 109.2457 | |
9856 | 0.00000000 | Kester Solder | 245 | Bulk | Active | Wire Solder | 24-7040 | - | - | 50°F ~ 104°F (10°C ~ 40°C) | - | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8311.30.6000 | 25 | Sn96.5Ag3.5 (96.5/3.5) | Spool, 1 lb (454 g) | 0.020" (0.51mm) | 430°F (221°C) | No-Clean | 24 AWG, 25 SWG | Lead Free | |||||
 |
SMD2SW.031 1LB | 38.7700 | |
5 | 0.00000000 | Chip Quik Inc. | SMD2 | Bulk | Active | Wire Solder | SMD2S | - | - | - | - | download | RoHS non-compliant | Not Applicable | REACH Affected | EAR99 | 8311.30.3000 | 1 | Sn60Pb40 (60/40) | Spool, 1 lb (454 g) | 0.031" (0.79mm) | 361 ~ 370°F (183 ~ 188°C) | No-Clean, Water Soluble | 20 AWG, 22 SWG | Leaded | - | ||||
|
84-7033-0118 | - | |
6815 | 0.00000000 | Kester Solder | - | Bulk | Active | Wire Solder | 84-7033 | - | - | 50°F ~ 104°F (10°C ~ 40°C) | - | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8311.30.6000 | 1 | Sn97Ag3 (97/3) | Spool, 11.02 lbs (5kg) | 0.118" (3.00mm) | 430 ~ 435°F (221 ~ 224°C) | - | 9 AWG, 11 SWG | Lead Free | |||||
|
92-6040-0039 | - | |
5735 | 0.00000000 | Kester Solder | 44 | Bulk | Obsolete | Wire Solder | 92-6040 | - | - | 50°F ~ 104°F (10°C ~ 40°C) | - | download | RoHS non-compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8311.30.3000 | 1 | Sn60Pb40 (60/40) | Spool, 17.64 oz (500g) | 0.040" (1.02mm) | 361 ~ 374°F (183 ~ 190°C) | Rosin Activated (RA) | 18 AWG, 19 SWG | Leaded | |||||
 |
25-7068-6411 | 367.5836 | |
7017 | 0.00000000 | Kester Solder | 331 | Bulk | Active | Wire Solder | 25-7068 | - | - | 50°F ~ 104°F (10°C ~ 40°C) | - | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8311.30.6000 | 25 | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | Spool, 4 lbs (1.81kg) | 0.062" (1.57mm) | 423 ~ 424°F (217 ~ 218°C) | Water Soluble | 14 AWG, 16 SWG | Lead Free | |||||
 |
2003721 | 173.5100 | |
7 | 0.00000000 | Harimatec Inc. | LOCTITE® GC 10 | Bulk | Active | Solder Paste | - | 12 Months | Date of Manufacture | 41°F ~ 77°F (5°C ~ 25°C) | - | download | ROHS3 Compliant | Not Applicable | EAR99 | 3810.10.0000 | 1 | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | Cartridge, 21.16 oz (600g) | - | 423°F (217°C) | No-Clean | - | Lead Free | - |
2000+
Daily average RFQ Volume
30,000,000
Standard Product Unit
2800+
Worldwide Manufacturers
15,000 m2
In-stock Warehouse
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